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LAMBDA THERMAL - TECHNICAL ARTICLES AND PRESENTATIONS

 
Technology   Applications   Products  Technical Articles
 
Semiconductor & Opto Packaging
   
Flip-Chip Process Improvements for Low Warpage

Low Temperature Curing of Epoxies with Microwaves

VFM Curing of Die Attach and Underfill Materials

Lead Free Solder Reflow Using VFM

Innovative Curing of High Reliability Advanced Polymeric Encapsulants

Comparsion of Die Level Stress in Chip on Board

Flip Chip Packages For Smart Cards and RFID Products

Curing Low Yields & Reliability Issues In Photonics Assembly

Variable Frequency Microwave For Chip-On-Board Glob Top Curing

Microwave Heating of metal filled electrically conductive adhesive curing

Microwave Curing Of Encapsulants For Electronic Packages

VFM Compared To Convection Cure Profiles

Area Array Encapsulation with Stencil Printing and Microwave Curing

Warpage Reduction for Flip Chip Under-Fill Assemblies
 
   
 
 
 
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