EMPLOYMENT
 
Advanced Thermal Solutions

Curing Applications Questionnaire
Feasibility Request
PLEASE COMPLETE THIS FORM TO HELP US SERVE YOU BETTER
 
     
How did you learn of Lambda Tech?  
Given Name  
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Company Name  
Office Phone:  
Mobile Phone / Pager:  
Email Address:  
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Please check appropriate box to describe your curing appliction
Flip Chip Underfill
Die attach
Continuous web/flow
Glob top
Coatings
Optoelectronic/Fiber Optic
Structural
Potting
Wafer level
Smart cards
   
If continuous web please specify per
   
Other (please describe)
Current process problem or objective
(please describe)
Please describe current
cure conditions
   
Gel stage?  yes    no
   
If yes, gel temp of
degrees C for minutes.
   
Dispensing method
   
Name and brand of epoxy (material)
   
 Oven currently used: Batch
Conveyor (belt)
Vertical
   
Environment oven used in: Production
Laboratory
Cleanroom
   
If in cleanroom,
please specify cleanroom rating:
ppm
   
Throughput information: Current:UPH      Target:UPH
   
Machine utilization: hours/day  days/week  weeks/year
 
   
 
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